TIS420C

TIS420C is a one component thermally conductive Gap Filler.

TIS420C is dispensed as a thixotropic paste, and cures at room temperature to become a mechanically stable silicone gel.

Due to its curing performance, TIS420C provides improved stability in 3-dimensional and vertical TIM applications that require a stress-absorbing, pump-out resistant, mechanically stable, and repairable heat path.

主要特點
♦High thermal conductivity
♦Physical stability due to polymerization during cure process Soft, stress-absorbing post cure properties
♦Can be dispensed in various thickness
♦Conforms to intricate shapes and component designs
♦Use within a broad operating temperature range
♦Repairable

顏色:灰色