TIA223G-DG/20SEM KIT/7.05LB-3.2KG

TIA223G is a 2-component, thermally conductive material for encapsulating, gap filling, and for use as a thermal path to heat sinks.

The flowability of TIA223G allows it to conform to complex 3-dimenstional shapes and cavities in potting applications, while also enabling it to be transferred in a thin layer as a liquid-dispensed alternative to thermal pads.

TIA223G quickly cures to a soft rubber gel with exposure to heat, and will also cure at room temperatures.

主要特點
♦Good thermal conductivity
♦Fast cure with exposure to heat
♦Easy to use 1:1 mixing ratio by weight or volume
♦Flame Retardant: UL94 V-0 certified (File No. E56745)

顏色:灰色