TIA216G

TIA216G is a 2-component, thermally conductive potting material. Its low viscosity allows the material to conform to intricate shapes of thermal interfaces and contributes to the reduction of contact interference in complex designs.

TIA216G quickly cures to a soft rubber, gel with exposure to heat, and retains tacky adhesion on its cured surface.

主要特點
♦Good thermal conductivity
♦Low viscosity
♦Fast cure with exposure to heat
♦Cures at room temperature
♦Easy to use 1:1 mixing ratio by weight or volume
♦Repairable

顏色:灰色